US Patent Issued to Kelvin Thermal Technologies on Nov. 4 for "Folding thermal ground plane" (Colorado, Minnesota Inventors)

ALEXANDRIA, Va., Nov. 6 -- United States Patent no. 12,464,679, issued on Nov. 4, was assigned to Kelvin Thermal Technologies Inc. (Boulder, Colo.).

"Folding thermal ground plane" was invented by Ryan J. Lewis (Boulder, Colo.), Yung-Cheng Lee (Boulder, Colo.), Ali Nematollahisarvestani (Boulder, Colo.), Jason W. West (Broomfield, Colo.) and Kyle Wagner (Minneapolis).

According to the abstract* released by the U.S. Patent & Trademark Office: "Some embodiments include a thermal ground plane comprising a first and second casing with folding and non-folding regions. The thermal ground plane may also include a vapor structure and a mesh. The mesh may be disposed on an interior surface of the second casing and the mesh include a plurality of ar...