ALEXANDRIA, Va., Nov. 25 -- United States Patent no. 12,480,716, issued on Nov. 25, was assigned to Kelvin Thermal Technologies Inc. (Boulder, Colo.).
"Thermal management planes" was invented by Ryan J. Lewis (Boulder, Colo.), Ronggui Yang (Broomfield, Colo.) and Yung-Cheng Lee (Boulder, Colo.).
According to the abstract* released by the U.S. Patent & Trademark Office: "Some embodiments include a thermal management plane. The thermal management plane may include a top casing comprising a polymer material; a top encapsulation layer disposed on the top casing; a bottom casing comprising a polymer material; a bottom encapsulation layer disposed on the bottom casing; a hermetical seal coupling the bottom casing with the top casing; a wicking ...