US Patent Issued to Kelvin Thermal Technologies on Jan. 13 for "Polymer-based microfabricated thermal ground plane" (Colorado Inventors)

ALEXANDRIA, Va., Jan. 13 -- United States Patent no. 12,523,431, issued on Jan. 13, was assigned to Kelvin Thermal Technologies Inc. (Boulder, Colo.).

"Polymer-based microfabricated thermal ground plane" was invented by Ryan John Lewis (Boulder, Colo.), Yung-Cheng Lee (Boulder, Colo.), Li-Anne Liew (Westminster, Colo.) and Yunda Wang (Denver).

According to the abstract* released by the U.S. Patent & Trademark Office: "Embodiments described herein relate to the concept and designs of a polymer-based thermal ground plane. In accordance with one embodiment, a polymer is utilized as the material to fabricate the thermal ground plane. Other embodiments include am optimized wicking structure design utilizing two arrays of micropillars, use of l...