ALEXANDRIA, Va., Aug. 12 -- United States Patent no. 12,385,697, issued on Aug. 12, was assigned to Kelvin Thermal Technologies Inc. (Boulder, Colo.).
"Micropillar-enabled thermal ground plane" was invented by Ryan John Lewis (Boulder, Colo.), Li-Anne Liew (Westminster, Colo.), Ching-Yi Lin (Longmont, Colo.), Collin Jennings Coolidge (Longmont, Colo.), Shanshan Xu (Boulder, Colo.), Ronggui Yang (Boulder, Colo.) and Yung-Cheng Lee (Boulder, Colo.).
According to the abstract* released by the U.S. Patent & Trademark Office: "A thermal ground plane (TGP) is disclosed. A TGP may include a first planar substrate member comprising copper and a second planar substrate member comprising a metal, wherein the first planar substrate member and the se...