US Patent Issued to KELK, TOKYO SEIMITSU on Oct. 14 for "Temperature control device for semiconductor wafer and temperature control method for semiconductor wafer" (Japanese Inventors)

ALEXANDRIA, Va., Oct. 21 -- United States Patent no. 12,444,626, issued on Oct. 14, was assigned to KELK Ltd. (Hiratsuka, Japan) and TOKYO SEIMITSU Co. LTD. (Hachioji, Japan).

"Temperature control device for semiconductor wafer and temperature control method for semiconductor wafer" was invented by Wataru Omuro (Hiratsuka, Japan), Atsushi Kobayashi (Hiratsuka, Japan), Takashi Motoyama (Hachioji, Japan) and Takenori Takahashi (Hachioji, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A temperature control device for a semiconductor wafer includes a placement part having a placement surface on which a semiconductor wafer is placed and having a plurality of regions in which the placement surface is partiti...