ALEXANDRIA, Va., Oct. 28 -- United States Patent no. 12,448,542, issued on Oct. 21, was assigned to KCTECH Co. Ltd. (Anseong-si, South Korea).
"Slurry composition for polishing organic film" was invented by Bo Hyeok Choi (Gyeonggi-do, South Korea), Jae Hak Lee (Gyeonggi-do, South Korea), Jae Woo Lee (Gyeonggi-do, South Korea), Ji Hye Kim (Gyeonggi-do, South Korea) and Jae Ik Lee (Gyeonggi-do, South Korea).
According to the abstract* released by the U.S. Patent & Trademark Office: "The present invention relates to a slurry composition for polishing an organic film, and the slurry composition for polishing an organic film according to one embodiment of the present invention comprises: abrasive particles; a polishing control agent containing...