US Patent Issued to KCTECH on May 20 for "CMP slurry composition for polishing polycrystalline silicon and polishing method using same" (South Korean Inventors)

ALEXANDRIA, Va., June 16 -- United States Patent no. 12,305,079, issued on May 20, was assigned to KCTECH Co. Ltd. (South Korea).

"CMP slurry composition for polishing polycrystalline silicon and polishing method using same" was invented by Jae Woo Lee (Gyeonggi-do, South Korea), Ji Hye Kim (Gyeonggi-do, South Korea) and Bo Hyeok Choi (Gyeonggi-do, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "The present disclosure relates to a CMP slurry composition for polishing polycrystalline silicon and a polishing method using the same. A CMP slurry composition for polishing polycrystalline silicon according to an embodiment of the present disclosure includes: abrasive particles; a surface roughness reduc...