ALEXANDRIA, Va., March 12 -- United States Patent no. 12,247,141, issued on March 11, was assigned to KCTECH Co. LTD. (Gyeonggi-do, South Korea).
"Polishing slurry composition" was invented by Nak Hyun Choi (Gyeonggi-do, South Korea), Jung Yoon Kim (Gyeonggi-do, South Korea), Hae Won Yang (Seoul, South Korea) and Soo Wan Choi (Seoul, South Korea).
According to the abstract* released by the U.S. Patent & Trademark Office: "The present invention relates to a polishing slurry composition. A polishing slurry composition according to an embodiment of the present disclosure comprises: a nonionic polymer having at least one amide bond; a selectivity control agent; and abrasive particles."
The patent was filed on Nov. 4, 2019, under Application ...