ALEXANDRIA, Va., Jan. 20 -- United States Patent no. 12,528,974, issued on Jan. 20, was assigned to KCTECH Co. LTD. (Gyeonggi-do, South Korea).
"Polishing slurry composition" was invented by Jung Hun Kim (Gyeonggi-do, South Korea), Jun Ha Hwang (Gyeonggi-do, South Korea) and O Seong Kwon (Gyeonggi-do, South Korea).
According to the abstract* released by the U.S. Patent & Trademark Office: "The present disclosure relates to a polishing slurry composition and to a polishing slurry composition including nanoceria abrasive particles and a water-soluble compound including an intramolecular hydrophilic group, and further selectively including at least one from among an amphoteric compound including an intramolecular carboxyl group and amine gro...