ALEXANDRIA, Va., Aug. 20 -- United States Patent no. 12,394,627, issued on Aug. 19, was assigned to KCTech Co. Ltd. (Anseong-si, South Korea).
"Substrate polishing system" was invented by Hee Sung Chae (Gyeonggi-do, South Korea), Seung Eun Lee (Seoul, South Korea) and Geun Sik Yun (Gyeonggi-do, South Korea).
According to the abstract* released by the U.S. Patent & Trademark Office: "A substrate polishing system may include a substrate transfer unit comprising a shaft to rotate on a rotation axis perpendicular to a ground and at least one transfer arm to support a bottom surface of a substrate and transfer the substrate while forming a transfer orbit by rotation of the shaft, and at least one carrier to perform polishing the substrate tran...