US Patent Issued to Kateeva on Jan. 13 for "Apparatus and techniques for electronic device encapsulation" (California Inventors)

ALEXANDRIA, Va., Jan. 13 -- United States Patent no. 12,525,467, issued on Jan. 13, was assigned to Kateeva Inc. (Newark, Calif.).

"Apparatus and techniques for electronic device encapsulation" was invented by Alexander Sou-Kang Ko (Santa Clara, Calif.), Justin Mauck (Belmont, Calif.), Eliyahu Vronsky (Los Altos, Calif.), Conor F. Madigan (San Francisco), Eugene Rabinovich (Fremont, Calif.), Nahid Harjee (Sunnyvale, Calif.), Christopher Buchner (Sunnyvale, Calif.) and Gregory Lewis (Mountain View, Calif.).

According to the abstract* released by the U.S. Patent & Trademark Office: "A method for providing a substrate coating comprises transferring a substrate to an enclosed ink jet printing system; printing organic material in a deposition ...