US Patent Issued to Kasai Industry, Nagoya Denki Educational Foundation on May 27 for "Thermal barrier material formed of inorganic material, material set for producing same, material for base layers and method for producing same" (Japanese Inventors)

ALEXANDRIA, Va., June 17 -- United States Patent no. 12,312,280, issued on May 27, was assigned to Kasai Industry Co. LTD. (Aichi, Japan) and Nagoya Denki Educational Foundation (Aichi, Japan).

"Thermal barrier material formed of inorganic material, material set for producing same, material for base layers and method for producing same" was invented by Junichi Kawano (Aichi, Japan) and Yuichi Kobayashi (Aichi, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A novel heat shielding material made of an inorganic material is proposed.A heat shielding material made of an inorganic material, including: a base material; a underlayer layered on the base material; and a top layer layered on the underlayer, where...