US Patent Issued to KANEKA on May 20 for "Laminate, single-sided metal-clad laminated sheet, and multi-layer printed wiring board" (Japanese Inventors)

ALEXANDRIA, Va., June 16 -- United States Patent no. 12,309,919, issued on May 20, was assigned to KANEKA Corp. (Osaka, Japan).

"Laminate, single-sided metal-clad laminated sheet, and multi-layer printed wiring board" was invented by Kanji Shimoosako (Otsu, Japan), Kentaro Tsukuya (Otsu, Japan), Hitoshi Yasuhira (Otsu, Japan) and Konoshin Fujimoto (Otsu, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "The laminate includes a multilayer polyimide film having thermoplastic polyimide layers on both sides of a core layer which is a non-thermoplastic polyimide film and a surface layer contacting the thermoplastic polyimide layer on one surface-side of the multilayer polyimide film. The surface layer may be a...