ALEXANDRIA, Va., June 4 -- United States Patent no. 12,319,849, issued on June 3, was assigned to Kaneka Corp. (Osaka, Japan).
"Adhesive composition, room-temperature-curable adhesive, and cured object" was invented by Hidenori Tanaka (Osaka, Japan).
According to the abstract* released by the U.S. Patent & Trademark Office: "It is an object of the present invention to achieve an adhesive composition which enables provision of a cured product having excellent mechanical properties. In order to attain the foregoing object, an adhesive composition in accordance with an embodiment of the present invention contains: a polyoxypropylene-based polymer (A) which has, the terminal thereof, not less than 0.6 (meth)acryloyl groups on average and whic...