ALEXANDRIA, Va., Feb. 12 -- United States Patent no. 12,221,563, issued on Feb. 11, was assigned to KANEKA Corp. (Osaka, Japan).
"Curable composition" was invented by Kiyoshi Miyafuji (Takasago, Japan).
According to the abstract* released by the U.S. Patent & Trademark Office: "A multi-part curable composition includes an A part including a polyoxyalkylene polymer (A) having a reactive silicon group, a (meth)acrylic ester polymer (B) having a reactive silicon group, an epoxy resin curing agent (D) having a tertiary amine moiety, an alicyclic structure-containing amine (E1), and a B part including an epoxy resin (C). Each of the reactive silicon groups of the polymer (A) and polymer (B) are represented by -SiR5cX3-c. R5 is a substituted or...