US Patent Issued to Kambix Innovations on Oct. 14 for "Heat transfer enhancement for three-dimensional integrated circuit chips" (California Inventors)

ALEXANDRIA, Va., Oct. 21 -- United States Patent no. 12,443,252, issued on Oct. 14, was assigned to Kambix Innovations LLC (Albuquerque, N.M.).

"Heat transfer enhancement for three-dimensional integrated circuit chips" was invented by Kambiz Vafai (Mission Viejo, Calif.) and Chao Wang (Riverside, Calif.).

According to the abstract* released by the U.S. Patent & Trademark Office: "In an embodiment, a method for fast prediction of hotspot temperatures in three-dimensional (3D) integrated circuit (IC) chips, can involve inputting a dataset comprising thermal simulation data and associated parameters for 3D IC chips, wherein the dataset includes variables such as power distribution, processor core location distribution, and Through Silicon Vi...