ALEXANDRIA, Va., June 10 -- United States Patent no. 12,293,957, issued on May 6, was assigned to Kambix Innovations II LLC (Albuquerque, N.M.).

"Optimization of the thermal performance of the 3D ICs utilizing the integrated chip-size double-layer or multi-layer microchannels" was invented by Kambiz Vafai (Mission Viejo, Calif.) and Sainan Lu (Jurupa Valley, Calif.).

According to the abstract* released by the U.S. Patent & Trademark Office: "A three-dimensional integrated circuit apparatus includes a three-dimensional integrated circuit including a group of integrated double-layer microchannels (DLMC) and multi-layer microchannels (MLMC) with optimized thermal performance for the three-dimensional integrated circuit. A heat source can be ...