US Patent Issued to JVCKENWOOD on March 4 for "Semiconductor wafer and method of manufacturing semiconductor chip" (Japanese Inventor)

ALEXANDRIA, Va., March 5 -- United States Patent no. 12,243,831, issued on March 4, was assigned to JVCKENWOOD Corp. (Yokohama, Japan).

"Semiconductor wafer and method of manufacturing semiconductor chip" was invented by Takayuki Iwasa (Yokohama, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor wafer includes: a rectangular circuit formation region provided on the semiconductor wafer; an electronic circuit formed in the circuit formation region; a first seal ring formed along each of four outer peripheral parts of the circuit formation region so as to surround an outer periphery of the circuit formation region; and a second seal ring formed, in parallel with the first seal ring, on outer ...