US Patent Issued to Jun Woo Sohn on June 24 for "Curing device for 3-dimensional printer product and curing method for 3-dimensional printer product" (South Korean Inventors)

ALEXANDRIA, Va., June 25 -- United States Patent no. 12,337,540, issued on June 24, was assigned to Jun Woo Sohn (Yorba Linda, Calif.).

"Curing device for 3-dimensional printer product and curing method for 3-dimensional printer product" was invented by Cheon Kee Chung (Seoul, South Korea) and Jaehyeon Leem (Seoul, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "The curing device for a 3D printer product may comprise a chamber having an accommodation space for accommodating 3D printer products (hereinafter referred to as 3D printer product), and configured to perform a curing process on the 3D printer product accommodated in the accommodation space under each of a first condition corresponding to ...