ALEXANDRIA, Va., June 19 -- United States Patent no. 12,332,563, issued on June 17, was assigned to JSR Corp. (Tokyo).
"Pattern-forming method and composition" was invented by Hiroyuki Komatsu (Tokyo) and Motohiro Shiratani (Tokyo).
According to the abstract* released by the U.S. Patent & Trademark Office: "A pattern-forming method includes applying a first composition on a surface layer of a substrate to form a first coating film. The surface layer includes a first region which includes a metal atom, and a second region which includes a silicon atom. The first coating film is heated. A portion other than a portion formed on the first region or a portion other than a portion formed on the second region of the first coating film heated is ...