ALEXANDRIA, Va., July 30 -- United States Patent no. 12,372,869, issued on July 29, was assigned to JSR Corp. (Tokyo).
"Method for forming resist pattern and radiation-sensitive resin composition" was invented by Kazuki Kasahara (Tokyo), Katsuaki Nishikori (Tokyo), Sosuke Osawa (Tokyo), Miki Tamada (Tokyo) and Motohiro Shiratani (Tokyo).
According to the abstract* released by the U.S. Patent & Trademark Office: "Provided are a method for forming a resist pattern that demonstrates excellent performance in sensitivity, resolution, etc. in an exposure step when a next-generation exposure technique is applied, and a radiation-sensitive resin composition. The method for forming a resist pattern includes step (1) of forming a resist film in whi...