US Patent Issued to JSR on Jan. 20 for "Photosensitive resin composition, method for producing resin film having pattern, resin film having pattern, and semiconductor circuit substrate" (Japanese Inventors)

ALEXANDRIA, Va., Jan. 20 -- United States Patent no. 12,529,958, issued on Jan. 20, was assigned to JSR Corp. (Tokyo).

"Photosensitive resin composition, method for producing resin film having pattern, resin film having pattern, and semiconductor circuit substrate" was invented by Torahiko Yamaguchi (Tokyo), Kimiyuki Kanno (Tokyo), Ryoji Tatara (Tokyo), Toshiaki Kadota (Tokyo), Ryoyu Hifumi (Tokyo) and Shoma Anabuki (Tokyo).

According to the abstract* released by the U.S. Patent & Trademark Office: "A photosensitive resin composition contains: a polymer (A) having a terminal group represented by Formula (a1) and a repeating structural unit represented by Formula (a2); a crosslinking agent (B); and a photocation generator (C). Y represents...