ALEXANDRIA, Va., Aug. 12 -- United States Patent no. 12,386,260, issued on Aug. 12, was assigned to JSR Corp. (Tokyo).
"Radiation-sensitive resin composition, method of forming resist pattern, polymer, and compound" was invented by Ryuichi Nemoto (Tokyo), Satoshi Okazaki (Tokyo) and Taiichi Furukawa (Tokyo).
According to the abstract* released by the U.S. Patent & Trademark Office: "A radiation-sensitive resin composition includes: a first polymer including a structural unit which includes an acid-labile group; a second polymer including a structural unit represented by formula (1); and a radiation-sensitive acid generator. R1 represents a monovalent organic group having 1 to 20 carbon atoms; R2 represents a monovalent organic group havin...