US Patent Issued to JSP on Oct. 14 for "Polypropylene-based resin expanded bead, method for producing same, and molded article of polypropylene-based resin expanded beads" (Japanese Inventors)

ALEXANDRIA, Va., Oct. 21 -- United States Patent no. 12,441,860, issued on Oct. 14, was assigned to JSP Corp. (Tokyo).

"Polypropylene-based resin expanded bead, method for producing same, and molded article of polypropylene-based resin expanded beads" was invented by Takumi Sakamura (Tochigi, Japan) and Hajime Ohta (Tochigi, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A polypropylene-based resin expanded bead having a tubular shape with a through-hole, containing a foamed core layer constituted by a polypropylene-based resin and a fusion-bonding layer covering the foamed core layer. An average hole diameter d of the through-hole in the expanded bead is less than 1 mm, and a ratio d/D of the average ...