US Patent Issued to JSP on May 20 for "Polypropylene-based resin expanded beads and method for producing polypropylene-based resin expanded beads" (Japanese Inventors)

ALEXANDRIA, Va., June 16 -- United States Patent no. 12,305,013, issued on May 20, was assigned to JSP Corp. (Tokyo).

"Polypropylene-based resin expanded beads and method for producing polypropylene-based resin expanded beads" was invented by Tokunobu Nohara (Tokyo) and Yasutaka Ode (Utsunomiya, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A polypropylene-based resin expanded beads configured to include an NOR type hindered amine and has a surface on which a thermoplastic polymer layer is located, in which a blending ratio of the amine in the expanded beads is 0.03 wt % or more and 0.5 wt % or less, and a blending ratio of the amine in the thermoplastic polymer layer is less than the blending ratio o...