ALEXANDRIA, Va., Oct. 21 -- United States Patent no. 12,442,099, issued on Oct. 14, was assigned to Johnson Matthey PLC (London).
"Electroplating solutions" was invented by Alan Boardman (Reading, Great Britain).
According to the abstract* released by the U.S. Patent & Trademark Office: "The invention relates to an aqueous electroplating solution for alkaline electroplating, comprising: [M(NH3)4]2+ ions, wherein M is selected from the group consisting of Pd or Pt; and organic anions selected from the group consisting of bicarbonate, carbonate, or a mixture thereof; wherein the following species, if present, are present in the following amounts: alkali metals in an amount of less than 5 g/L; compounds comprising phosphorus in an amount of ...