US Patent Issued to Joanneum Research Forschungsgesellschaft mbH on Oct. 28 for "Lithographic method for imprinting three-dimensional microstructures having oversized structural heights into a carrier material" (Austrian Inventors)

ALEXANDRIA, Va., Oct. 28 -- United States Patent no. 12,455,503, issued on Oct. 28, was assigned to Joanneum Research Forschungsgesellschaft mbH (Graz, Austria).

"Lithographic method for imprinting three-dimensional microstructures having oversized structural heights into a carrier material" was invented by Ladislav Kuna (Puch bei Weiz, Austria), Markus Postl (Graz, Austria) and Barbara Stadlober (Graz, Austria).

According to the abstract* released by the U.S. Patent & Trademark Office: "The invention relates to a lithographic process for embossing three-dimensional microstructures, which have oversized structure heights, in a photostructurable carrier material using an exposure device, wherein an oversized structure height has a height w...