US Patent Issued to JNC on Aug. 12 for "Condensation-curable resin composition, cured product, molded body, and semiconductor device" (Japanese Inventors)

ALEXANDRIA, Va., Aug. 12 -- United States Patent no. 12,384,888, issued on Aug. 12, was assigned to JNC Corp. (Tokyo).

"Condensation-curable resin composition, cured product, molded body, and semiconductor device" was invented by Hironori Ikeno (Chiba, Japan), Kazuya Suwa (Chiba, Japan), Keisuke Nishizawa (Chiba, Japan), Ayaka Kiya (Chiba, Japan) and Kiichi Kawabata (Chiba, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A condensation-curable resin composition which contains: (A) an organosilicon compound containing a structural unit (i) represented by the following formula (i) and a structural unit (ii) represented by the following formula (ii), having a SiOH group at both ends of the molecular chain,...