US Patent Issued to JMJ Korea on Oct. 21 for "Semiconductor package module including vertical terminals" (South Korean Inventor)

ALEXANDRIA, Va., Oct. 28 -- United States Patent no. 12,451,410, issued on Oct. 21, was assigned to JMJ Korea Co. Ltd. (Busan, South Korea).

"Semiconductor package module including vertical terminals" was invented by Yun Hwa Choi (Busan, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "Provided is a semiconductor package module including vertical terminals in which the vertical terminals are connected to increase the number of terminals, problems on bending of the terminals may be solved while in electrical connection, and resistance of electrical signals may be reduced."

The patent was filed on Feb. 13, 2023, under Application No. 18/109,190.

*For further information, including images, charts an...