US Patent Issued to JMJ Korea on Aug. 26 for "Clip structure for semiconductor package and semiconductor package including the same" (South Korean Inventor)

ALEXANDRIA, Va., Aug. 26 -- United States Patent no. 12,400,991, issued on Aug. 26, was assigned to JMJ Korea Co. Ltd. (Bucheon-si, South Korea).

"Clip structure for semiconductor package and semiconductor package including the same" was invented by Yun Hwa Choi (Bucheon-si, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "Provided is a clip structure for a semiconductor package comprising: a first bonding unit bonded to a terminal part of an upper surface or a lower surface of a semiconductor device by using a conductive adhesive interposed therebetween, a main connecting unit which is extended and bent from the first bonding unit, a second bonding unit having an upper surface higher than the uppe...