US Patent Issued to JIANGMEN DEZHONGTAI ENGINEERING PLASTICS TECHNOLOGY on May 27 for "Preparation method for copper clad laminate having low dielectric constant and high peel strength, copper clad laminate and application thereof" (Chinese Inventors)

ALEXANDRIA, Va., June 17 -- United States Patent no. 12,311,646, issued on May 27, was assigned to JIANGMEN DEZHONGTAI ENGINEERING PLASTICS TECHNOLOGY Co. LTD. (China).

"Preparation method for copper clad laminate having low dielectric constant and high peel strength, copper clad laminate and application thereof" was invented by Yonghua Liang (Jiangmen, China), Liangwen Jin (Jiangmen, China) and Hongzhuan Zheng (Jiangmen, China).

According to the abstract* released by the U.S. Patent & Trademark Office: "Disclosed is a preparation method for a copper clad laminate comprising: (1) dissolving a polymer in an organic solvent, heating and stirring to obtain a pre-impregnation liquid; (2) impregnating a liquid crystal polymer cloth in the pre-...