US Patent Issued to JetCool Technologies on June 3 for "Actively cooled heat-dissipation lids for computer processors and processor assemblies" (Massachusetts Inventors)

ALEXANDRIA, Va., June 4 -- United States Patent no. 12,324,126, issued on June 3, was assigned to JetCool Technologies Inc. (Littleton, Mass.).

"Actively cooled heat-dissipation lids for computer processors and processor assemblies" was invented by Bernard Malouin (Westford, Mass.) and Jordan Mizerak (Belmont, Mass.).

According to the abstract* released by the U.S. Patent & Trademark Office: "Actively cooled heat-dissipation lid for removing excess heat from heat-generating devices attached to printed circuit boards, processor assemblies and other electronic devices, the actively cooled heat-dissipation lid comprising a first plate configured to be placed in thermal communication with a heat-generating device, a raised sidewall to facilit...