ALEXANDRIA, Va., Jan. 29 -- United States Patent no. 12,213,254, issued on Jan. 28, was assigned to JESS-LINK PRODUCTS Co. LTD. (New Taipei, Taiwan).
"Multi-layer printed circuit board" was invented by Yu-Liang Liu (New Taipei, Taiwan).
According to the abstract* released by the U.S. Patent & Trademark Office: "A multi-layer printed circuit board includes a base-layer metal, multiple middle metal layers and a top-layer metal. The middle metal layers are stacked on the base-layer metal sequentially. The top-layer metal is disposed on the middle metal layers. The base-layer metal, each middle metal layer and the top-layer metal are formed with multiple through holes respectively. Part of the middle metal layers are separately formed with mu...