ALEXANDRIA, Va., June 19 -- United States Patent no. 12,332,001, issued on June 17, was assigned to Jentech Precision Industrial Co. LTD. (Taoyuan, Taiwan).
"Method of manufacturing heat dissipation module" was invented by Chun-Yi Chiang (Taoyuan, Taiwan), Yi-Sheng Chiu (Taoyuan, Taiwan) and Chiao Hsiang Chang (Taoyuan, Taiwan).
According to the abstract* released by the U.S. Patent & Trademark Office: "A method of manufacturing heat dissipation module is provided. The method includes: providing a main body; disposing a thermal interface material (TIM) layer on the main body; applying a first pressure to a surface of the TIM layer away from the main body in stages regionally; and applying a second pressure to an entire portion of the surf...