US Patent Issued to JCET STATS ChipPAC Korea on Sept. 30 for "Semiconductor device and method of forming conductive structure for EMI shielding and heat dissipation" (South Korean Inventors)

ALEXANDRIA, Va., Sept. 30 -- United States Patent no. 12,431,437, issued on Sept. 30, was assigned to JCET STATS ChipPAC Korea Ltd. (South Korea).

"Semiconductor device and method of forming conductive structure for EMI shielding and heat dissipation" was invented by SeungHyun Lee (Incheon, South Korea) and HeeSoo Lee (Incheon, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor device has an antenna substrate and a component module disposed over the antenna substrate. The component module includes an electrical component, and a conductive structure formed around the electrical component. Alternatively, an electrical component can be disposed over the antenna substrate, and a conductiv...