US Patent Issued to JCET STATS ChipPAC Korea on Oct. 14 for "Semiconductor device and method of forming compartment shielding for a semiconductor package" (South Korean Inventors)

ALEXANDRIA, Va., Oct. 21 -- United States Patent no. 12,444,718, issued on Oct. 14, was assigned to JCET STATS ChipPAC Korea Ltd. (South Korea).

"Semiconductor device and method of forming compartment shielding for a semiconductor package" was invented by SeungHyun Lee (Incheon, South Korea), YeJin Park (Incheon, South Korea) and HeeSoo Lee (Incheon, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor device has a substrate. A first electrical component and second electrical component are disposed over the substrate. A zero-ohm resistor is disposed over the substrate between the first electrical component and second electrical component. An encapsulant is deposited over the substrate, ...