US Patent Issued to JCET SEMICONDUCTOR (SUQIAN) on Oct. 28 for "Manufacturing method of semiconductor packaging member, semiconductor packaging member and mounting method thereof" (Chinese Inventors)

ALEXANDRIA, Va., Oct. 28 -- United States Patent no. 12,456,667, issued on Oct. 28, was assigned to JCET SEMICONDUCTOR (SUQIAN) Co. LTD. (Suqian, China).

"Manufacturing method of semiconductor packaging member, semiconductor packaging member and mounting method thereof" was invented by Kai Liu (Suqian, China) and Sai Xu (Suqian, China).

According to the abstract* released by the U.S. Patent & Trademark Office: "The present invention provides a manufacturing method of a semiconductor packaging member, a semiconductor packaging member and a mounting method thereof. The manufacturing method of the semiconductor packaging member includes the following steps of: forming a through hole running through vertically in an outer pin of a lead frame,...