ALEXANDRIA, Va., Nov. 25 -- United States Patent no. 12,482,765, issued on Nov. 25, was assigned to JCET GROUP Co. LTD. (Wuxi, China).
"Packaging structure and manufacturing method thereof" was invented by Yaojian Lin (Wuxi, China), Danfeng Yang (Wuxi, China), Chen Xu (Wuxi, China) and Chenye He (Wuxi, China).
According to the abstract* released by the U.S. Patent & Trademark Office: "The present invention provides a packaging structure and a manufacturing method thereof. The packaging structure includes an interposer, chips, and warpage adjustment structures, wherein the interposer includes a first surface and a second surface opposite thereto, and the chips are electrically connected to the first surface of the interposer; the warpage a...