ALEXANDRIA, Va., Nov. 18 -- United States Patent no. 12,476,222, issued on Nov. 18, was assigned to JCET GROUP Co. LTD. (Wuxi, China).
"Fan-out package structure" was invented by Yaojian Lin (Wuxi, China).
According to the abstract* released by the U.S. Patent & Trademark Office: "The present invention discloses a fan-out package structure. The fan-out package structure includes: a redistribution layer, a solder ball disposed below the redistribution layer, a high-heat chip and a low-heat chip that are electrically connected above the redistribution layer, and a plastic package material disposed above the redistribution layer in a filling manner and coating the high-heat chip and the low-heat chip, wherein an upper surface of the high-hea...