US Patent Issued to JCET GROUP on May 13 for "Package structure and method for forming same" (Chinese Inventor)

ALEXANDRIA, Va., June 12 -- United States Patent no. 12,300,590, issued on May 13, was assigned to JCET GROUP Co. LTD. (Wuxi, China).

"Package structure and method for forming same" was invented by Yaojian Lin (Wuxi, China).

According to the abstract* released by the U.S. Patent & Trademark Office: "The present invention discloses a package structure and a method for forming the same. The package structure includes a substrate, a chip, a first plastic package layer and a support block, wherein the substrate includes a first surface and a second surface; the chip is disposed on the first surface; the first plastic package layer is disposed on the first surface and packages the chip; the support block is disposed on the second surface; and ...