US Patent Issued to JCET ADVANCED PACKAGING on Feb. 10 for "Chip packaging structure and chip packaging method" (Chinese Inventors)

ALEXANDRIA, Va., Feb. 11 -- United States Patent no. 12,550,776, issued on Feb. 10, was assigned to JCET ADVANCED PACKAGING Co. LTD. (Wuxi, China).

"Chip packaging structure and chip packaging method" was invented by Hong Xu (Wuxi, China), Dong Chen (Wuxi, China), Xia Xu (Wuxi, China), Dou Jin (Wuxi, China) and Jinhui Chen (Wuxi, China).

According to the abstract* released by the U.S. Patent & Trademark Office: "The present invention provides a chip packaging structure and a chip packaging method. Compared with an existing method of joining an encapsulation layer with a dielectric layer, adhesion between the encapsulation layer and a chip in the present invention is increased, and the encapsulation layer is less likely to fall off under s...