ALEXANDRIA, Va., March 12 -- United States Patent no. 12,249,530, issued on March 11, was assigned to JAPAN DISPLAY INC. (Tokyo).
"Wafer for electronic components" was invented by Kenichi Takemasa (Tokyo), Kazuyuki Yamada (Tokyo), Keisuke Asada (Tokyo) and Daiki Isono (Tokyo).
According to the abstract* released by the U.S. Patent & Trademark Office: "According to one embodiment, a wafer for electronic components, includes a sapphire substrate including a first surface and a second surface on an opposite side to the first surface and a plurality of electronic components located on a side of the first surface, and the sapphire substrate includes trench portions located between respective adjacent electronic components, and the trench porti...