US Patent Issued to JAPAN DISPLAY on July 1 for "Method of mounting electronic component" (Japanese Inventors)

ALEXANDRIA, Va., July 3 -- United States Patent no. 12,347,806, issued on July 1, was assigned to JAPAN DISPLAY INC. (Tokyo).

"Method of mounting electronic component" was invented by Kenichi Takemasa (Tokyo), Kazuyuki Yamada (Tokyo), Keisuke Asada (Tokyo) and Daiki Isono (Tokyo).

According to the abstract* released by the U.S. Patent & Trademark Office: "According to one embodiment, a method of mounting electronic components, includes placing a workpiece comprising an insulating substrate including a first surface, a circuit board including a terminal portion and a spacer, a sapphire substrate including a second surface and a wafer including the electronic components, bringing the pressure jig into contact with a part of the sapphire sub...