ALEXANDRIA, Va., Feb. 5 -- United States Patent no. 12,219,702, issued on Feb. 4, was assigned to JAPAN DISPLAY INC. (Tokyo).
"Wiring substrate and display device" was invented by Kenichi Takemasa (Tokyo) and Yasushi Nakano (Tokyo).
According to the abstract* released by the U.S. Patent & Trademark Office: "A wiring substrate includes a substrate, an insulating film stacked on the substrate, an anode pad stacked on a first surface of the insulating film and electrically coupled to an anode of an inorganic light-emitting diode, a cathode pad stacked on the first surface of the insulating film and electrically coupled to a cathode of the inorganic light-emitting diode, and an auxiliary pad provided to the first surface of the insulating fil...