ALEXANDRIA, Va., Jan. 13 -- United States Patent no. 12,522,702, issued on Jan. 13, was assigned to JAPAN COMPOSITE Co. LTD. (Tokyo).
"Thin plate molding material and molded article" was invented by Masahiro Hakotani (Shizuoka, Japan), Hirokuni Fujita (Shizuoka, Japan) and Takashi Tsukamoto (Shizuoka, Japan).
According to the abstract* released by the U.S. Patent & Trademark Office: "A thin plate molding material includes a resin composition containing a resin component and a filling material, and a reinforced fiber with a predetermined fiber length. The content ratio of the reinforced fiber is a predetermined ratio. The mixing ratio of the resin component is a predetermined ratio."
The patent was filed on April 22, 2021, under Applicati...