ALEXANDRIA, Va., Sept. 17 -- United States Patent no. 12,419,022, issued on Sept. 16, was assigned to JABIL INC..

"Apparatus, system, and method of providing a circuit board carrier for an underfill system" was invented by Mark Tudman (St. Petersburg, Fla.) and Rayce Loftin (St. Petersburg, Fla.).

According to the abstract* released by the U.S. Patent & Trademark Office: "An apparatus, system and method for a carrier suitable to carry a circuit board through a semiconductor underfill process. The apparatus, system and method includes a modular carrier capable of supporting a printed circuit board during at least an underfill process, the modular carrier comprising: an outer frame having, at least about a center point thereof, at least one...