US Patent Issued to JABIL on Jan. 28 for "Apparatus, system, and method of providing a ramped interconnect for semiconductor fabrication" (Florida Inventors)

ALEXANDRIA, Va., Jan. 29 -- United States Patent no. 12,211,713, issued on Jan. 28, was assigned to JABIL INC..

"Apparatus, system, and method of providing a ramped interconnect for semiconductor fabrication" was invented by Lim Lai Ming (St. Petersburg, Fla.) and Zambri Bin Samsudin (St. Petersburg, Fla.).

According to the abstract* released by the U.S. Patent & Trademark Office: "The disclosure is and includes at least an apparatus, system and method for a ramped electrical interconnection for use in semiconductor fabrications. The apparatus, system and method includes at least a first semiconductor substrate having thereon a first electrical circuit comprising first electrical components; a second semiconductor substrate at least parti...