ALEXANDRIA, Va., Dec. 2 -- United States Patent no. 12,490,387, issued on Dec. 2, was assigned to Jabil Inc. (St. Petersburg, Fla.).
"Adhesive circuit patterning process" was invented by LaiMing Lim (Penang, Malaysia) and Zambri Bin Samsudin (Penang, Malaysia).
According to the abstract* released by the U.S. Patent & Trademark Office: "Disclosed are processes and materials for adhesive circuit patterning which strengthen and protect printed circuit traces and adhesive bonded joints of surface mounted devices in flexible or stretchable electronics in a single process. A method for adhesive circuit pattering include deposing a circuit pattern on a thermal adhesive film. One or more surface mounted device(s) are attached to a cured printed c...