ALEXANDRIA, Va., Sept. 23 -- United States Patent no. 12,420,375, issued on Sept. 23, was assigned to IV TECHNOLOGIES Co. LTD (Taichung, Taiwan).
"Polishing pad and polishing method" was invented by Kun-Che Pai (Taichung, Taiwan), Wei Chen Liu (Taichung, Taiwan) and Chung-Ru Wu (Kaohsiung, Taiwan).
According to the abstract* released by the U.S. Patent & Trademark Office: "A polishing pad adapted for polishing an object and having a polishing track region is provided. The polishing pad includes a polishing layer and an adhesive layer. The polishing layer has a polishing surface and a rough bottom surface opposite to each other, and the rough bottom surface includes a plurality of discontinuous dents. The adhesive layer is adhered to the r...