US Patent Issued to IUCF-HYU (INDUSTRY-UNIVERSITY COOPERATION FOUNDATION HANYANG UNIVERSITY) on Sept. 2 for "Substrate processing apparatus and substrate processing method" (South Korean Inventors)

ALEXANDRIA, Va., Sept. 3 -- United States Patent no. 12,406,834, issued on Sept. 2, was assigned to IUCF-HYU (INDUSTRY-UNIVERSITY COOPERATION FOUNDATION HANYANG UNIVERSITY) (Seoul, South Korea).

"Substrate processing apparatus and substrate processing method" was invented by Chin Wook Chung (Seoul, South Korea) and Moo Young Lee (Seoul, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "The present invention relates to a substrate processing apparatus and a substrate processing method. A substrate processing apparatus according to an embodiment of the present invention includes a chamber; a susceptor located inside the chamber to support a substrate to be processed; a first plasma control plate locat...